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Now showing items 106328-106347 of 108064
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W boson cross sections and single spin asymmetries in polarized proton-proton collisions at [square root of] s =500 GeV at STAR
(Massachusetts Institute of Technology, 2012)Understanding the structure of the proton is an ongoing effort in the particle physics community. Existing in the region of nonperturbative QCD, the various models for proton structure must be informed and constrained by ... -
W cross section measurement in the electron channel in pp collisions at [the square root of sigma]= 7 TeV
(Massachusetts Institute of Technology, 2011)From March until November 2010 the Compact Muon Solenoid 36 pb-1 of pp collisions at [the square root of sigma]= 7 TeV. One of the first precision Model that can be performed with this data is the measurement cross section ... -
W-SPSA : an Efficient Stochastic Approximation Algorithm for the off-line calibration of Dynamic Traffic Assignment models
(Massachusetts Institute of Technology, 2014)The off-line calibration is a crucial step for the successful application of Dynamic Traffic Assignment (DTA) models in transportation planning and real time traffic management. While traditional approaches focus on the ... -
W-state Analyzer and Multi-party Measurement-device-independent Quantum Key Distribution
(Nature Publishing Group, 2015-12)W-state is an important resource for many quantum information processing tasks. In this paper, we for the first time propose a multi-party measurement-device-independent quantum key distribution (MDI-QKD) protocol based ... -
WaaZam! : supporting creative play at a distance in customized video environments
(Massachusetts Institute of Technology, 2014)This thesis presents the design, implementation and evaluation of WaaZam, a telepresence system for families that supports social engagement through creative play in a unified video space. The goal of the project is to ... -
WaaZam!: supporting creative play at a distance in customized video environments
(Association for Computing Machinery, 2014-05)We present the design, and evaluation of WaaZam, a video mediated communication system designed to support creative play in customized environments. Users can interact together in virtual environments composed of digital ... -
Wafer bonding : mechanics-based models and experiments
(Massachusetts Institute of Technology, 2004)Direct wafer bonding has emerged as an important technology in the manufacture of silicon-on-insulator substrates (SOI), microelectromechanical systems (MEMS), and three-dimensional integrated circuits (3D IC's). While the ... -
Wafer bonding for monolithic integration of Si CMOS VLSI electronics with III-V optoelectronic devices
(Massachusetts Institute of Technology, 1999)GaAs-on-silicon epitaxy techniques as well as wafer bonding GaAs to Si, have been developed to overcome lattice mismatch in order to integrate optoelectronic and Si devices. However, the thermal expansion differences between ... -
Wafer bonding of processed Si CMOS VLSI and GaAs for mixed technology integration
(Massachusetts Institute of Technology, 2002)The successful bonding of bare thinned Si SOI wafers to bare GaAs wafers in previous research has proven to be an important first step in achieving integration of Si electronics with GaAs optoelectronic devices. The thinning ... -
Wafer defect prediction with statistical machine learning
(Massachusetts Institute of Technology, 2016)In the semiconductor industry where the technology continues to grow in complexity while also striving to achieve lower manufacturing costs, it is becoming increasingly important to drive cost savings by screening out ... -
Wafer integrated micro-scale concentrating photovoltaics
(American Institute of Physics (AIP), 2017-09)Recent development of a novel micro-scale PV/CPV technology is presented. The Wafer Integrated Micro-scale PV approach (WPV) seamlessly integrates multijunction micro-cells with a multi-functional silicon platform that ... -
Wafer surface cleaning for silicon homoepitaxy with and without ECR hydrogen plasma exposure
(Massachusetts Institute of Technology, 1994) -
Wafer-Level Thermocompression Bonds
(2003-01)Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding without the application of an electric field or complicated pre-bond cleaning procedure. The presence of a ductile ... -
Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits
(Institute of Electrical and Electronics Engineers, 2009-10)In this work, we modified our wafer-scale 3D integration technique, originally developed for Si, to hybridize InP-based image sensor arrays with Si readout circuits. InGaAs image arrays based on the InGaAs layer grown on ... -
Wafer-scale 3D integration of silicon-on-insulator RF amplifiers
(Institute of Electrical and Electronics Engineers, 2009-02)RF amplifiers are demonstrated using a three- dimensional (3D) wafer-scale integration technology based on silicon-on-insulator (SOI) CMOS process. This new 3D implementation reduces the amplifier size and shortens ... -
Wafer-scale integrated active silicon photonics for manipulation and conversion of light
(Massachusetts Institute of Technology, 2016)Silicon photonics is an emerging platform that promises to revolutionize integrated optics. This is expected to happen by inheriting the cost-effective, very large scale integration capabilities from complementary ... -
Wage and employment effects of immigration to Germany : an analysis based on local labor markets
(Cambridge, Mass. : Dept. of Economics, Massachusetts Institute of Technology, 1994) -
Wage compensation and mobility patterns within unionized firms : the role of internal labor markets
(Cambridge, Mass. : Alfred P. Sloan School of Management, Massachusetts Institute of Technology, 1988]) -
Wage determination in the men's shoe industry : a case study of the shoe producing district centered around Brockton, Massachusetts
(Massachusetts Institute of Technology, 1949) -
Wage determination theory and the five-dollar day at Ford : a detailed examiniation
(Massachusetts Institute of Technology, 1987)
