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<title>Warren M. Rohsenow Heat and Mass Transfer Laboratory</title>
<link>http://hdl.handle.net/1721.1/5549</link>
<description/>
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<rdf:li rdf:resource="http://hdl.handle.net/1721.1/7315"/>
<rdf:li rdf:resource="http://hdl.handle.net/1721.1/7314"/>
<rdf:li rdf:resource="http://hdl.handle.net/1721.1/7313"/>
<rdf:li rdf:resource="http://hdl.handle.net/1721.1/7312"/>
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<dc:date>2013-05-25T13:14:44Z</dc:date>
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<item rdf:about="http://hdl.handle.net/1721.1/7315">
<title>Thermal control of electronics: Perspectives and prospects</title>
<link>http://hdl.handle.net/1721.1/7315</link>
<description>Thermal control of electronics: Perspectives and prospects
Hannemann, R.J.
One of the most prominent industrial applications of heat&#13;
transfer science and engineering has been electronics thermal&#13;
control. Driven by the relentless increase in spatial density of&#13;
microelectronic devices, integrated circuit chip powers have&#13;
risen by a factor of 100 over the past twenty years, with a&#13;
somewhat smaller increase in heat flux. The traditional&#13;
approaches using natural convection and forced-air cooling are&#13;
becoming less viable as power levels increase. This paper&#13;
provides a high-level overview of the thermal management&#13;
problem from the perspective of a practitioner, as well as&#13;
speculation on the prospects for electronics thermal engineering&#13;
in years to come.
</description>
<dc:date>2003-05-01T00:00:00Z</dc:date>
</item>
<item rdf:about="http://hdl.handle.net/1721.1/7314">
<title>Thermal management of electronics: Energy conversion issues</title>
<link>http://hdl.handle.net/1721.1/7314</link>
<description>Thermal management of electronics: Energy conversion issues
Bar-Cohen, A.
</description>
<dc:date>2003-05-01T00:00:00Z</dc:date>
</item>
<item rdf:about="http://hdl.handle.net/1721.1/7313">
<title>Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers</title>
<link>http://hdl.handle.net/1721.1/7313</link>
<description>Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers
Chu, R.C.; Bar-Cohen, Avi; Edwards, David; Herrlin, Magnus; Price, Donald; Schmidt, Roger; Joshi, Jogenda; Chryser, George M.; Garimella, Suresh; Mok, Larry; Sammakia, Bahgat; Yeh, Lian-Tuu
</description>
<dc:date>2003-05-01T00:00:00Z</dc:date>
</item>
<item rdf:about="http://hdl.handle.net/1721.1/7312">
<title>Nanostructures and energy conversion</title>
<link>http://hdl.handle.net/1721.1/7312</link>
<description>Nanostructures and energy conversion
Dresselhaus, M.S.
The unique properties of nanostructures associated with&#13;
their low dimensionality give rise to new opportunities for research&#13;
on nanoscale heat transfer and energy conversion. Inspired&#13;
by Majumdar’s analysis of the novel aspects of heat, mass,&#13;
and charge flow across the interface between hard and soft materials,&#13;
some perspectives about research frontiers in nanoscale&#13;
heat transfer and energy conversion are provided.
</description>
<dc:date>2003-05-01T00:00:00Z</dc:date>
</item>
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