http://hdl.handle.net/1721.1/5552 http://hdl.handle.net/1721.1/7315 Thermal control of electronics: Perspectives and prospects Hannemann, R.J. One of the most prominent industrial applications of heat transfer science and engineering has been electronics thermal control. Driven by the relentless increase in spatial density of microelectronic devices, integrated circuit chip powers have risen by a factor of 100 over the past twenty years, with a somewhat smaller increase in heat flux. The traditional approaches using natural convection and forced-air cooling are becoming less viable as power levels increase. This paper provides a high-level overview of the thermal management problem from the perspective of a practitioner, as well as speculation on the prospects for electronics thermal engineering in years to come. http://hdl.handle.net/1721.1/7314 Thermal management of electronics: Energy conversion issues Bar-Cohen, A. http://hdl.handle.net/1721.1/7313 Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers Chu, R.C. Bar-Cohen, Avi Edwards, David Herrlin, Magnus Price, Donald Schmidt, Roger Joshi, Jogenda Chryser, George M. Garimella, Suresh Mok, Larry Sammakia, Bahgat Yeh, Lian-Tuu http://hdl.handle.net/1721.1/7312 Nanostructures and energy conversion Dresselhaus, M.S. The unique properties of nanostructures associated with their low dimensionality give rise to new opportunities for research on nanoscale heat transfer and energy conversion. Inspired by Majumdar’s analysis of the novel aspects of heat, mass, and charge flow across the interface between hard and soft materials, some perspectives about research frontiers in nanoscale heat transfer and energy conversion are provided.