http://hdl.handle.net/1721.1/5552 Thu, 23 May 2013 12:36:08 GMT 2013-05-23T12:36:08Z http://hdl.handle.net/1721.1/7315 Thermal control of electronics: Perspectives and prospects Hannemann, R.J. One of the most prominent industrial applications of heat transfer science and engineering has been electronics thermal control. Driven by the relentless increase in spatial density of microelectronic devices, integrated circuit chip powers have risen by a factor of 100 over the past twenty years, with a somewhat smaller increase in heat flux. The traditional approaches using natural convection and forced-air cooling are becoming less viable as power levels increase. This paper provides a high-level overview of the thermal management problem from the perspective of a practitioner, as well as speculation on the prospects for electronics thermal engineering in years to come. Thu, 01 May 2003 00:00:00 GMT http://hdl.handle.net/1721.1/7315 2003-05-01T00:00:00Z http://hdl.handle.net/1721.1/7314 Thermal management of electronics: Energy conversion issues Bar-Cohen, A. Thu, 01 May 2003 00:00:00 GMT http://hdl.handle.net/1721.1/7314 2003-05-01T00:00:00Z http://hdl.handle.net/1721.1/7313 Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers Chu, R.C.; Bar-Cohen, Avi; Edwards, David; Herrlin, Magnus; Price, Donald; Schmidt, Roger; Joshi, Jogenda; Chryser, George M.; Garimella, Suresh; Mok, Larry; Sammakia, Bahgat; Yeh, Lian-Tuu Thu, 01 May 2003 00:00:00 GMT http://hdl.handle.net/1721.1/7313 2003-05-01T00:00:00Z http://hdl.handle.net/1721.1/7312 Nanostructures and energy conversion Dresselhaus, M.S. The unique properties of nanostructures associated with their low dimensionality give rise to new opportunities for research on nanoscale heat transfer and energy conversion. Inspired by Majumdar’s analysis of the novel aspects of heat, mass, and charge flow across the interface between hard and soft materials, some perspectives about research frontiers in nanoscale heat transfer and energy conversion are provided. Thu, 01 May 2003 00:00:00 GMT http://hdl.handle.net/1721.1/7312 2003-05-01T00:00:00Z