Show simple item record

dc.contributor.advisorSteven Eppinger.en_US
dc.contributor.authorCheng, Karen,S.M.Massachusetts Institute of Technology.en_US
dc.contributor.otherMassachusetts Institute of Technology. Engineering and Management Program.en_US
dc.contributor.otherSystem Design and Management Program.en_US
dc.date.accessioned2019-09-26T21:00:19Z
dc.date.available2019-09-26T21:00:19Z
dc.date.copyright2019en_US
dc.date.issued2019en_US
dc.identifier.urihttps://hdl.handle.net/1721.1/122336
dc.descriptionThesis: S.M. in Engineering and Management, Massachusetts Institute of Technology, System Design and Management Program, 2019en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (pages 61-65).en_US
dc.description.abstractPackaging plays an essential role in protecting a product from damage, attracting consumers to purchase a product, and facilitating storage and consumption. Yet its appreciation and value is quickly eroded once the product is purchased and/or consumed and the package becomes waste. With the passing of China's National Sword policy in 2018, post-consumer materials recycling markets are threatened and resources are not being recovered due to high contamination rates. The development of new packaging material has surged in recent years but has not corresponded with development of the necessary recycling infrastructure. Consumers want to recycle but are confused about how to most effectively do so. Packaging continues to consume our finite resources and pollute our terrestrial and marine environments. This research takes a systems approach to understanding today's emerging waste challenges and identifies key obstacles that society should collectively solve. High impact opportunity areas include alignment amongst all key stakeholders, establishing standardized signage and labels, increasing consumer education, and tackling difficult-to-recycle materials through scaling up technology, enacting policy, providing materials alternatives with corresponding infrastructure, or redesigning packaging.en_US
dc.description.statementofresponsibilityby Karen Cheng.en_US
dc.format.extent65 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsMIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectEngineering and Management Program.en_US
dc.subjectSystem Design and Management Program.en_US
dc.titleSustainable packaging approaches for current waste challengesen_US
dc.typeThesisen_US
dc.description.degreeS.M. in Engineering and Managementen_US
dc.contributor.departmentMassachusetts Institute of Technology. Engineering and Management Programen_US
dc.identifier.oclc1119537133en_US
dc.description.collectionS.M.inEngineeringandManagement Massachusetts Institute of Technology, System Design and Management Programen_US
dspace.imported2019-09-26T21:00:19Zen_US
mit.thesis.degreeMasteren_US
mit.thesis.departmentSysDesen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record