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Now showing items 11-13 of 13
Cleaning process development and optimization in the surface mount assembly line of power modules
(Massachusetts Institute of Technology, 2011)
The cleaning process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This ...
Root cause analysis of solder flux residue incidence in the manufacture of electronic power modules
(Massachusetts Institute of Technology, 2011)
This work investigates the root causes of the incidence of solder flux residue underneath electronic components in the manufacture of power modules. The existing deionized water-based centrifugal cleaning process was ...
Robustness and repeatability of interdigitated electrodes on a substrate tested in an aqueous environment
(Massachusetts Institute of Technology, 2011)
Interdigitated electrodes are currently being used as sensing components in microfluidic lab-on-a-chip devices. The Daktari Diagnostics system uses these electrodes to measure the change in impedance of a fluid in an assay ...