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Elimination of PZT thin film breakage caused by electric current arcing and intrinsic differential strains during poling
(Massachusetts Institute of Technology, 2012)
Historically, substrate breakage during the poling process has been responsible for a 2% yield loss for a contract manufacturer specializing in volume production of lead zirconate titatate (PZT) thin film devices. In this ...
Lean manufacturing in a mass customization plant : improvement of Kanban policy and implementation
(Massachusetts Institute of Technology, 2011)
This thesis documents the application of the principles of lean manufacturing and supply chain planning at Varian Semiconductor Equipment Associates. Varian is a manufacturer of ion implantation machines, and supplies and ...
Root cause analysis of solder flux residue incidence in the manufacture of electronic power modules
(Massachusetts Institute of Technology, 2011)
This work investigates the root causes of the incidence of solder flux residue underneath electronic components in the manufacture of power modules. The existing deionized water-based centrifugal cleaning process was ...
Robustness and repeatability of interdigitated electrodes on a substrate tested in an aqueous environment
(Massachusetts Institute of Technology, 2011)
Interdigitated electrodes are currently being used as sensing components in microfluidic lab-on-a-chip devices. The Daktari Diagnostics system uses these electrodes to measure the change in impedance of a fluid in an assay ...
Cleaning process development and optimization in the surface mount assembly line of power modules
(Massachusetts Institute of Technology, 2011)
The cleaning process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This ...
Quality improvement and control based on defect reduction
(Massachusetts Institute of Technology, 2010)
This thesis addresses the quality improvement in a printing process at a food packaging company now experiencing hundreds of printing defects. Methodologies of Define, Measure, Analyze, Improve, and Control (DMAIC), and ...
Control of WIP and reduction of lead time in a food packaging company
(Massachusetts Institute of Technology, 2010)
High inventory holding costs, strain on warehouse capacity and the competition of lead time are concerns of a food packaging manufacturer. In this work, causes of high WIP were identified and three approaches were developed ...
Information tracking and sharing in organic photovoltaic panel manufacturing
(Massachusetts Institute of Technology, 2011)
The MIT MEng team of four worked with Konarka Technologies, a world leading organic solar panel manufacturer, on production tracking and analysis as well as various operational improvement projects. MIT's collaborative ...
Design and implementation of a continuous improvement framework for an organic photovoltaic panels manufacturer
(Massachusetts Institute of Technology, 2011)
The MIT MEng Team worked at Konarka Technologies, the world leader organic photovoltaic panels (OPV) manufacturer, on several improvement projects. The concentration was on operations improvement as well as production ...
Statistical control and experimental design for edge bead reduction in laminating process
(Massachusetts Institute of Technology, 2010)
Edge bead formation is a well-known phenomenon typically happening in the lamination due to the physics of this process. It causes the defect of high edge observed in the carton roll after the laminated carton sheets are ...