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An investigation of low temperature transient liquid phase bonding of silver, gold, and copper

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An investigation of low temperature transient liquid phase bonding of silver, gold, and copper

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Author: Roman, John W. (John William)
Department: Massachusetts Institute of Technology. Dept. of Materials Science and Engineering
Publisher: Massachusetts Institute of Technology
Date Issued: 1991
Description:
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1991.Includes bibliographical references (leaves 110-112)
URI: http://hdl.handle.net/1721.1/13483
Keywords: Materials Science and Engineering

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