| dc.contributor.advisor |
Thomas W. Eagar. |
en_US |
| dc.contributor.author |
Roman, John W. (John William) |
en_US |
| dc.date.accessioned |
2005-09-21T22:45:17Z |
|
| dc.date.available |
2005-09-21T22:45:17Z |
|
| dc.date.issued |
1991 |
en_US |
| dc.identifier.uri |
http://hdl.handle.net/1721.1/13483 |
|
| dc.description |
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1991. |
en_US |
| dc.description |
Includes bibliographical references (leaves 110-112) |
en_US |
| dc.description.provenance |
Made available in DSpace on 2005-09-21T22:45:17Z (GMT). No. of bitstreams: 2
25698439.pdf: 7793480 bytes, checksum: 5e4e01a9020b7ba3b35ca63a2497663d (MD5)
25698439-MIT.pdf: 7793241 bytes, checksum: 8f6be6d4146fb0341e3f5c24ce50fcbf (MD5)
Previous issue date: 1991 |
en |
| dc.description.statementofresponsibility |
by John W. Roman. |
en_US |
| dc.format.extent |
112 leaves |
en_US |
| dc.format.extent |
7793480 bytes |
|
| dc.format.extent |
7793241 bytes |
|
| dc.format.mimetype |
application/pdf |
|
| dc.format.mimetype |
application/pdf |
|
| dc.language.iso |
eng |
en_US |
| dc.publisher |
Massachusetts Institute of Technology |
en_US |
| dc.rights |
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. |
en_US |
| dc.rights.uri |
http://dspace.mit.edu/handle/1721.1/7582 |
|
| dc.subject |
Materials Science and Engineering |
en_US |
| dc.title |
An investigation of low temperature transient liquid phase bonding of silver, gold, and copper |
en_US |
| dc.type |
Thesis |
en_US |
| dc.description.degree |
M.S. |
en_US |
| dc.contributor.department |
Massachusetts Institute of Technology. Dept. of Materials Science and Engineering |
en_US |
