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New methodologies for interconnect reliability assessments of integrated circuits

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New methodologies for interconnect reliability assessments of integrated circuits

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Author: Hau-Riege, Stefan P. (Stefan Peter), 1970-
Other Contributors: Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Advisor: Carl V. Thompson.
Department: Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Publisher: Massachusetts Institute of Technology
Date Issued: 2000
Description:
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2000.Includes bibliographical references (leaves 245-251).
URI: http://hdl.handle.net/1721.1/31092
Keywords: Materials Science and Engineering.

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