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Real time process monitoring of solder paste stencil printing

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dc.contributor.advisor Haruhiko Asada. en_US
dc.contributor.author Braunstein, Daniel J. (Daniel Judah) en_US
dc.date.accessioned 2007-01-10T15:57:14Z
dc.date.available 2007-01-10T15:57:14Z
dc.date.copyright 1994 en_US
dc.date.issued 1994 en_US
dc.identifier.uri http://hdl.handle.net/1721.1/35374
dc.description Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994. en_US
dc.description Includes bibliographical references (leaves 61-64). en_US
dc.description.statementofresponsibility by Daniel J. Braunstein. en_US
dc.format.extent 64 leaves en_US
dc.format.extent 2680802 bytes
dc.format.extent 2849292 bytes
dc.format.mimetype application/pdf
dc.format.mimetype application/pdf
dc.language.iso eng en_US
dc.publisher Massachusetts Institute of Technology en_US
dc.rights M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. en_US
dc.rights.uri http://dspace.mit.edu/handle/1721.1/7582
dc.subject Mechanical Engineering en_US
dc.title Real time process monitoring of solder paste stencil printing en_US
dc.type Thesis en_US
dc.description.degree M.S. en_US
dc.contributor.department Massachusetts Institute of Technology. Dept. of Mechanical Engineering en_US
dc.identifier.oclc 30822279 en_US


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