Browsing Singapore-MIT Alliance (SMA) by Author "Shah, M."
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Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
Shah, M.; Zeng, K.; Tay, A.A.O.; Suresh, Subra (2002-01)With increasing miniaturization in microelectronics the wirebonds used in IC packages are witnessing a thrust towards fine pitch wirebonding. To have a precise control over loop height of the wirebond for fine pitch ...