Wei, F.; Hau-Riege, S.P.; Gan, C.L.; Thompson, Carl V.; Clement, J.J.; Tay, H.L.; Yu, B.; Radhakrishnan, M.K.; Pey, Kin Leong; Choi, Wee Kiong
(2002-01)
The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike ...