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Browsing Innovation in Manufacturing Systems and Technology (IMST) by Title

Research and Teaching Output of the MIT Community

Browsing Innovation in Manufacturing Systems and Technology (IMST) by Title

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  • Zhang, W.Y.; Tor, Shu Beng; Britton, G.A. (2004-01)
    This paper presents an intelligent, hybrid system for stamping process planning in progressive die design. The system combines the flexibility of blackboard architecture with case-based reasoning. The hybrid system has the ...
  • Aumond, Bernardo D.; El Rifai, Osamah M.; Youcef-Toumi, Kamal (2003-01)
    Surface characteristics such as topography and critical dimensions serve as important indicators of product quality and manufacturing process performance especially at the micrometer and the nanometer scales. This paper ...
  • Wang, S.Z.; Yoon, Soon Fatt (2004-01)
    GaAs-based InGaAsN/GaAs quantum well is found to be very sensitive to growth conditions and ex-situ annealing processes. Annealing could drastically increase the optical quality of GaAs-based InGaAsN/GaAs quantum well. As ...
  • Fu, Yongqi; Ngoi, Kok Ann Bryan (2005-01)
    Holes with different sizes from microscale to nanoscale were directly fabricated by focused ion beam (FIB) milling in this paper. Maximum aspect ratio of the fabricated holes can be 5:1 for the hole with large size with ...
  • Ganesan, Bala; Hardt, David E. (2004-01)
    Micro embossing is the process of fabricating micron-sized features by plastic deformation of a work piece by means of a shaped tool or die. In our work we are concerned with hot embossing of PMMA to produce features in ...
  • Cheong, Michelle L.F.; Bhatnagar, Rohit; Graves, Stephen C. (2005-01)
    Most logistics network design models assume exogenous customer demand that is independent of the service time or level. This paper examines the benefits of segmenting demand according to lead-time sensitivity of customers. ...
  • Cheong, Michelle L.F. (2004-01)
    Logistics has been an important part of every economy and every business entity. The worldwide trend in globalization has led to many companies outsourcing their logistics function to Third-Party Logistics (3PL) companies, ...
  • Qi, Chao; Appa Iyer, Sivakumar; Ganesan, Viswanath Kumar (2005-01)
    This paper analyzes a proposed release controlmethodology, WIPLOAD Control (WIPLCtrl), using a transfer line case modeled by Markov process modeling methodology. The performance of WIPLCtrl is compared with that of CONWIP ...
  • Lu, Wen Feng; Deng, Y.-M. (2004-01)
    Due to the increasing demand of application-specific and/or multi-functional materials, it is necessary to integrate material design and product design. To support such design integration, this paper proposes a methodology ...
  • Noh, Kyungyoon; Saka, Nannaji; Chun, Jung-Hoon (2003-01)
    The Chemical-mechanical polishing (CMP) process is now widely employed in the ultralarge scale integration chip fabrication. Due to the continuous advances in semiconductor fabrication technology and decreasing sub-micron ...
  • Noh, Kyungyoon; Lai, Jiun-Yu; Saka, Nannaji; Chun, Jung-Hoon (2002-01)
    The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fabrication. However, due to the complexity of process parameters on the material removal rate (MRR), mechanism of material ...
  • Tang, Y.; Loh, Han Tong; Fuh, J.-Y.-H.; Lu, L.; Wong, Yeow Sheong; Thian, S. C. H. (2005-01)
    A novel process based on the principle of layered photolithography has been proposed and tested for making real three-dimensional micro-structures. An experimental setup was designed and built for doing experiments on this ...
  • Loh, Han Tong; Menon, Rakesh; Leong, Christopher K. (2002-01)
    In the prevailing world economy, competition is keen and firms need to have an edge over their competitors for profitability and sometimes, even for the survival of the business itself. One way to help achieve this is the ...
  • Bhatnagar, Rohit; Venkataramanaiah, S.; Rajagopalan, Anand (2003-01)
    Intense competitive pressures have led to compressed product life cycles and frequent introduction of new products. This creates demand volatility and a consequent pressure on manufacturing to meet this variable demand. ...
  • Zhang, Zhenyu; Gershwin, Stanley B. (2006-01)
    Kanban and Constant Work-In-Process (CONWIP) control methods are designed to impose tight controls over inventory, while providing a satisfactory production rate. This paper generalizes systems with kanban or CONWIP control ...
  • Jang, Young Jae; Gershwin, Stanley B. (2006-01)
    This paper presents a model and analysis of a re-entrant production line with finite buffers and unreliable machines. Semiconductor device and liquid crystal display (LCD) fabrication processes are characterized as a ...
  • Jang, Young Jae; Gershwin, Stanley B. (2005-01)
    This paper presents a model and analysis of a synchronous tandem flow line that produces different part types on unreliable machines. The machines operate according to a static priority rule, operating on the highest ...
  • Chun, Jung-Hoon; Saka, Nannaji; Noh, Kyungyoon (2004-01)
    A formidable challenge in the present multi-step Cu CMP process, employed in the ultra-large-scale integration (ULSI) technology, is the control of wafer surface non-uniformity, which primarily is due to dielectric erosion ...
  • El Rifai, Osamah M.; Youcef-Toumi, Kamal (2004-01)
    A new dynamic model is presented for piezoelectric tube actuators commonly used in high-precision instruments. The model captures coupling between motions in all three axes such as bending motion due to a supposedly pure ...
  • Wang, S.Z.; Yoon, Soon Fatt; Ng, Teck Khim; Loke, W.K.; Fan, W.J. (2002-01)
    In this article, we report an attempt of extending the InGaAsN materials towards 1.3µm and 1.55µm wavelength. All these InGaAsN samples are grown in a plasma-assisted solid-source molecular-beam epitaxy (SS-MBE) system. ...
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