Advanced Search
DSpace@MIT

Browsing Innovation in Manufacturing Systems and Technology (IMST) by Title

Research and Teaching Output of the MIT Community

Browsing Innovation in Manufacturing Systems and Technology (IMST) by Title

Sort by: Order: Results:

  • A Lab Scale Polymer Micro-Embossing Machine for Process Control Research 
    Ganesan, Bala; Hardt, David E. (2004-01)
    Micro embossing is the process of fabricating micron-sized features by plastic deformation of a work piece by means of a shaped tool or die. In our work we are concerned with hot embossing of PMMA to produce features in ...
  • Logistics Network Design with Differentiated Delivery Lead-Time: Benefits and Insights 
    Cheong, Michelle L.F.; Bhatnagar, Rohit; Graves, Stephen C. (2005-01)
    Most logistics network design models assume exogenous customer demand that is independent of the service time or level. This paper examines the benefits of segmenting demand according to lead-time sensitivity of customers. ...
  • Logistics Outsourcing and 3PL Challenges 
    Cheong, Michelle L.F. (2004-01)
    Logistics has been an important part of every economy and every business entity. The worldwide trend in globalization has led to many companies outsourcing their logistics function to Third-Party Logistics (3PL) companies, ...
  • Markov Process Modeling of A System Under WIPLOAD Control 
    Qi, Chao; Appa Iyer, Sivakumar; Ganesan, Viswanath Kumar (2005-01)
    This paper analyzes a proposed release controlmethodology, WIPLOAD Control (WIPLCtrl), using a transfer line case modeled by Markov process modeling methodology. The performance of WIPLCtrl is compared with that of CONWIP ...
  • Material and Product Design Integration: Establishing Relationships between Design Variables of Both Domains 
    Lu, Wen Feng; Deng, Y.-M. (2004-01)
    Due to the increasing demand of application-specific and/or multi-functional materials, it is necessary to integrate material design and product design. To support such design integration, this paper proposes a methodology ...
  • A Mechanical Model for Erosion in Copper Chemical-Mechanical Polishing 
    Noh, Kyungyoon; Saka, Nannaji; Chun, Jung-Hoon (2003-01)
    The Chemical-mechanical polishing (CMP) process is now widely employed in the ultralarge scale integration chip fabrication. Due to the continuous advances in semiconductor fabrication technology and decreasing sub-micron ...
  • Mechanics,Mechanisms and Modeling of the Chemical Mechanical Polishing Process 
    Noh, Kyungyoon; Lai, Jiun-Yu; Saka, Nannaji; Chun, Jung-Hoon (2002-01)
    The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fabrication. However, due to the complexity of process parameters on the material removal rate (MRR), mechanism of material ...
  • Micro-layered-photolithography for Micro-Fabrication and Micro-Molding 
    Tang, Y.; Loh, Han Tong; Fuh, J.-Y.-H.; Lu, L.; Wong, Yeow Sheong; Thian, S. C. H. (2005-01)
    A novel process based on the principle of layered photolithography has been proposed and tested for making real three-dimensional micro-structures. An experimental setup was designed and built for doing experiments on this ...
  • Mining Of Text In The Product Development Process 
    Loh, Han Tong; Menon, Rakesh; Leong, Christopher K. (2002-01)
    In the prevailing world economy, competition is keen and firms need to have an edge over their competitors for profitability and sometimes, even for the survival of the business itself. One way to help achieve this is the ...
  • A Model for Contingent Manpower Planning: Insights from a High Clock Speed Industry 
    Bhatnagar, Rohit; Venkataramanaiah, S.; Rajagopalan, Anand (2003-01)
    Intense competitive pressures have led to compressed product life cycles and frequent introduction of new products. This creates demand volatility and a consequent pressure on manufacturing to meet this variable demand. ...
  • Modeling and Analysis of Manufacturing Systems with Multiple-Loop Structures 
    Zhang, Zhenyu; Gershwin, Stanley B. (2006-01)
    Kanban and Constant Work-In-Process (CONWIP) control methods are designed to impose tight controls over inventory, while providing a satisfactory production rate. This paper generalizes systems with kanban or CONWIP control ...
  • Modeling and Analysis of Re-entrant Production Systems 
    Jang, Young Jae; Gershwin, Stanley B. (2006-01)
    This paper presents a model and analysis of a re-entrant production line with finite buffers and unreliable machines. Semiconductor device and liquid crystal display (LCD) fabrication processes are characterized as a ...
  • Modeling and Analysis of Two-Part Type Manufacturing Systems 
    Jang, Young Jae; Gershwin, Stanley B. (2005-01)
    This paper presents a model and analysis of a synchronous tandem flow line that produces different part types on unreliable machines. The machines operate according to a static priority rule, operating on the highest ...
  • Modeling Dielectric Erosion in Multi-Step Copper Chemical-Mechanical Polishing 
    Chun, Jung-Hoon; Saka, Nannaji; Noh, Kyungyoon (2004-01)
    A formidable challenge in the present multi-step Cu CMP process, employed in the ultra-large-scale integration (ULSI) technology, is the control of wafer surface non-uniformity, which primarily is due to dielectric erosion ...
  • Modeling of Piezoelectric Tube Actuators 
    El Rifai, Osamah M.; Youcef-Toumi, Kamal (2004-01)
    A new dynamic model is presented for piezoelectric tube actuators commonly used in high-precision instruments. The model captures coupling between motions in all three axes such as bending motion due to a supposedly pure ...
  • Molecular Beam Epitaxy of Ga(In)AsN/GaAs Quantum Wells towards 1.3µm and 1.55µm 
    Wang, S.Z.; Yoon, Soon Fatt; Ng, Teck Khim; Loke, W.K.; Fan, W.J. (2002-01)
    In this article, we report an attempt of extending the InGaAsN materials towards 1.3µm and 1.55µm wavelength. All these InGaAsN samples are grown in a plasma-assisted solid-source molecular-beam epitaxy (SS-MBE) system. ...
  • Moving HomePlug to Industrial Applications with Power-Line Communication Network 
    Zhao, Z.W.; Chen, I-Ming (2004-01)
    Home networking is becoming an attractive application not only for the Internet access but also for home automation. Being a high-speed and dominant standard presently, HomePlug has an important role in home LAN connecting ...
  • Multi-Item Single-Vendor-Single-Buyer Problem with Consideration of Transportation Quantity Discount 
    Wang, Ye-Xin; Bhatnagar, Rohit; Graves, Stephen C. (2006-01)
    This paper deals with the problem of shipping multiple commodities from a single vendor to a single buyer. Each commodity is assumed to be constantly consumed at the buyer, and periodically replenished from the vendor. ...
  • Multiple Input-Multiple Output Cycle-to-Cycle Control of Manufacturing Processes 
    Rzepniewski, Adam K.; Hardt, David E. (2003-01)
    Cycle-to-cycle control is a method for using feedback to improve product quality for processes that are inaccessible within a single processing cycle. This limitation stems from the impossibility or the prohibitively high ...
  • A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing 
    Noh, Kyungyoon; Saka, Nannaji; Chun, Jung-Hoon (2005-01)
    The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the ...
MIT-Mirage