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A Mechanical Model for Erosion in Copper Chemical-Mechanical Polishing
(2003-01)
The Chemical-mechanical polishing (CMP) process is now widely employed in the ultralarge scale integration chip fabrication. Due to the continuous advances in semiconductor fabrication technology and decreasing sub-micron ...
Mechanics,Mechanisms and Modeling of the Chemical Mechanical Polishing Process
(2002-01)
The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fabrication. However, due to the complexity of process parameters on the material removal rate (MRR), mechanism of material ...