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Title:
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MEMS Materials and Processes: a research overview |
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Author:
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Spearing, S. Mark |
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Issue Date:
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2003-01 |
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Abstract:
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An overview is provided of materials and processes research currently being conducted in support of MEMS device design at MIT. Underpinning research is being conducted in five areas: room temperature strength characterization, elevated temperature strength characterization, processing of Si/SiC hybrid structures, modeling of wafer bonding processes and development of high temperature fluid interconnections. Emphasis is placed on the key areas of materials science and engineering. |
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URI:
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http://hdl.handle.net/1721.1/3667
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Series/Report no.:
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Advanced Materials for Micro- and Nano-Systems (AMMNS); |
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Keywords:
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microelectromechanical systems, mechanical properties, process development, process modeling |
