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Length Effects on the Reliability of Dual-Damascene Cu Interconnects

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dc.contributor.author Wei, F.
dc.contributor.author Hau-Riege, S.P.
dc.contributor.author Gan, C.L.
dc.contributor.author Thompson, Carl V.
dc.contributor.author Clement, J.J.
dc.contributor.author Tay, H.L.
dc.contributor.author Yu, B.
dc.contributor.author Radhakrishnan, M.K.
dc.contributor.author Pey, Kin Leong
dc.contributor.author Choi, Wee Kiong
dc.date.accessioned 2003-12-20T19:42:21Z
dc.date.available 2003-12-20T19:42:21Z
dc.date.issued 2002-01
dc.identifier.uri http://hdl.handle.net/1721.1/3977
dc.description.abstract The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike Al-based interconnects, no critical length exists, below which all Cu lines are ‘immortal’. Furthermore, we found multi-modal failure statistics for long lines, suggesting multiple failure mechanisms. Some long Cu interconnect segments have very large lifetimes, whereas in Al segments, lifetimes decrease continuously with increasing line length. It is postulated that the large lifetimes observed in long Cu lines result from liner rupture at the bottom of the vias, which allows continuous flow of Cu between the two bond pads. As a consequence, the average lifetimes of short lines and long lines can be higher than those of lines with intermediate lengths. en
dc.description.sponsorship Singapore-MIT Alliance (SMA) en
dc.format.extent 228936 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.relation.ispartofseries Advanced Materials for Micro- and Nano-Systems (AMMNS);
dc.subject interconnects en
dc.subject reliability en
dc.subject length effects en
dc.title Length Effects on the Reliability of Dual-Damascene Cu Interconnects en
dc.type Article en


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