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Identification of Convection Constants for Electronic Packages Using Modified Genetic Algorithm and Reduced-Basis Method

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dc.contributor.author Yang, Zhenglin
dc.contributor.author Lee, Jung Hong
dc.contributor.author Liu, Guirong
dc.contributor.author Patera, Anthony T.
dc.contributor.author Lam, Khin Yong
dc.date.accessioned 2003-12-23T02:33:45Z
dc.date.available 2003-12-23T02:33:45Z
dc.date.issued 2002-01
dc.identifier.uri http://hdl.handle.net/1721.1/4004
dc.description.abstract A new inverse analysis method is presented to identify parameters of heat convection in microelectronic packages. This approach adopts a modified Micro Genetic Algorithm (µGA) in finding the global optimum of parameters. A reduced-basis approach is introduced in the forward heat transfer analysis so as to significantly improve the efficiency in the calculation. Different identification procedures are employed to identify heat convection coefficients of a typical microelectronic package. Comparisons between different algorithms are performed. Results show that the use of the reduced-basis method together with the modified µGA outperforms the conventional GAs significantly. The presented method of coefficient identification is ideal for practical applications. It is efficient enough even for online analysis of both forward and inverse problem. en
dc.description.sponsorship Singapore-MIT Alliance (SMA) en
dc.format.extent 244695 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.relation.ispartofseries High Performance Computation for Engineered Systems (HPCES);
dc.subject inverse analysis en
dc.subject microelectronic package en
dc.subject modified µGA en
dc.subject parameter identification en
dc.subject reduced-basis method en
dc.title Identification of Convection Constants for Electronic Packages Using Modified Genetic Algorithm and Reduced-Basis Method en
dc.type Article en


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