Tracking Wires on Printed Circuit Boards
Name
AI_WP_052.pdf
Description
Main article
Size
778.16 KB
Format
Adobe PDF
Checksum (MD5)
27f76c213a6ccfdadd782a625564dcea
Author(s)
Finin, Tim
Date Issued
October 1973
Publisher
MIT Artificial Intelligence Laboratory
Series/Report no.
MIT Artificial Intelligence Laboratory Working Papers, WP-52
Abstract
This working paper describes a collection of LISP programs written to examine the backs of printed circuit boards. These programs find and trace the conductive wires plated on the insulating material. The "pads", or solder connections between these plated wires and leads from components on the front of the board, are also recognized and located by these programs.
Description
Work reported herein was conducted at the Artificial Intelligence Laboratory, a Massachusetts Institute of Technology research program supported in part by the Advanced Research Projects Agency of the Department of Defense and monitored by the Office of Naval Research under Contract Number N00014-70-A-0362-0005.
Vision Flashes are informal papers intended for internal use.
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