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Fatigue crack propagation along polymer-metal interfaces in microelectronic packages

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Title: Fatigue crack propagation along polymer-metal interfaces in microelectronic packages
Author: Guzek, John S. (John Stephen)
Advisor: Subra Suresh.
Department: Massachusetts Institute of Technology. Dept. of Materials Science and Engineering
Publisher: Massachusetts Institute of Technology
Issue Date: 1996
Description: Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.Includes bibliographical references (p. 84-87).
URI: http://hdl.handle.net/1721.1/41401
Keywords: Materials Science and Engineering

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