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Wettability of low Sn solders on integrated circuit package metallizations

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dc.contributor.advisor Nicholas J. Grant. en_US
dc.contributor.author Gabriel, Michelle Wendy en_US
dc.contributor.other Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. en_US
dc.date.accessioned 2008-09-03T14:34:40Z
dc.date.available 2008-09-03T14:34:40Z
dc.date.copyright 1983 en_US
dc.date.issued 1983 en_US
dc.identifier.uri http://hdl.handle.net/1721.1/42094
dc.description Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1983. en_US
dc.description MICROFICHE COPY AVAILABLE IN ARCHIVES AND SCIENCE en_US
dc.description Includes bibliographical references. en_US
dc.description.statementofresponsibility by Michelle Wendy Gabriel. en_US
dc.format.extent 73 leaves en_US
dc.language.iso eng en_US
dc.publisher Massachusetts Institute of Technology en_US
dc.rights M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. en_US
dc.rights.uri http://dspace.mit.edu/handle/1721.1/7582 en_US
dc.subject Materials Science and Engineering. en_US
dc.title Wettability of low Sn solders on integrated circuit package metallizations en_US
dc.type Thesis en_US
dc.description.degree M.S. en_US
dc.contributor.department Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. en_US
dc.identifier.oclc 10959189 en_US


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