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A new coating method for semiconductor lithography : fluid layer overlap in extrusion-spin coating

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dc.contributor.advisor Jung-Hoon Chun. en_US
dc.contributor.author Derksen, James Stephen en_US
dc.date.accessioned 2008-11-07T20:13:39Z
dc.date.available 2008-11-07T20:13:39Z
dc.date.copyright 1997 en_US
dc.date.issued 1997 en_US
dc.identifier.uri http://hdl.handle.net/1721.1/43575
dc.description Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1997. en_US
dc.description Includes bibliographical references (p. 128-131). en_US
dc.description.statementofresponsibility by James Stephen Derksen. en_US
dc.format.extent 131 p. en_US
dc.language.iso eng en_US
dc.publisher Massachusetts Institute of Technology en_US
dc.rights M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. en_US
dc.rights.uri http://dspace.mit.edu/handle/1721.1/7582 en_US
dc.subject Mechanical Engineering en_US
dc.title A new coating method for semiconductor lithography : fluid layer overlap in extrusion-spin coating en_US
dc.title.alternative Fluid layer overlap in extrusion-spin coating en_US
dc.type Thesis en_US
dc.description.degree M.S. en_US
dc.contributor.department Massachusetts Institute of Technology. Dept. of Mechanical Engineering en_US
dc.identifier.oclc 39919203 en_US


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