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Fabrication and material characterization of silver cantilevers via direct surface micromachining

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dc.contributor.advisor Martin A. Schmidt. en_US
dc.contributor.author Lam, Eric W. (Eric Wing-Jing) en_US
dc.contributor.other Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. en_US
dc.date.accessioned 2009-06-25T20:34:32Z
dc.date.available 2009-06-25T20:34:32Z
dc.date.copyright 2008 en_US
dc.date.issued 2008 en_US
dc.identifier.uri http://hdl.handle.net/1721.1/45613
dc.description Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008. en_US
dc.description This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections. en_US
dc.description Includes bibliographical references. en_US
dc.description.abstract Microelectromechanical Systems (MEMS) rely heavily on the semiconductor industry's manufacturing paradigm. While the standardized process model allows semiconductor chips to benefit from economy of scale and be sold at low prices, MEMS devices use specialized processes and subsequently have to be sold at higher prices. This severely hinders MEMS development because it is not economically feasible to research and develop specialized devices where only small volumes are needed. As such, tools and processes which divorce MEMS fabrication from this paradigm are needed. Using Hewlett-Packard thermal inkjet technology mounted to an X-Y microcontroller stage, we present a mask-less, or direct, surface micromachining process flow with a 250°C thermal budget. The process uses Cabot Corp.'s silver-based conductive ink for the structural layer and PMMA for the sacrificial layer. Several other materials were tested for use as sacrificial inks in addition to PMMA. Silver cantilevers with dimensions of 200x50[mu]m and 200x100[mu]m were fabricated as a demonstration of the process. The silver cantilevers were mechanically characterized by using force-deflection measurements made by a P-10 contact profilometer or a Hysitron nanoindentor. We present findings of 21.9±1.50GPa or 22±1.5GPa for the silver ink's Young's modulus of elasticity, depending on the characterization method. These measurements were consistent with results measured by nanoindentating Cabot silver films. We hypothesize that the film's porosity is the cause of the silver's reduced material properties. Some preliminary data supporting this hypothesis is provided, and potential methods of improving the material properties and the surface micromachining process are discussed. en_US
dc.description.statementofresponsibility by Eric W. Lam. en_US
dc.format.extent 61 p. en_US
dc.language.iso eng en_US
dc.publisher Massachusetts Institute of Technology en_US
dc.rights M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. en_US
dc.rights.uri http://dspace.mit.edu/handle/1721.1/7582 en_US
dc.subject Electrical Engineering and Computer Science. en_US
dc.title Fabrication and material characterization of silver cantilevers via direct surface micromachining en_US
dc.type Thesis en_US
dc.description.degree S.M. en_US
dc.contributor.department Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. en_US
dc.identifier.oclc 319540418 en_US


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