Shaver, David C.; Keast, Craig L.; Wheeler, Bruce D.; Hu, WeiLin; Bolkhovsky, Vladimir; Berger, Robert; Suntharalingam, Vyshnavi; Soares, Antonio M.; Donnelly, Joseph P.; Mahoney, Leonard J.; Oakley, Douglas C.; Chapman, David C.; Knecht, Jeffrey M.; Yost, Donna-Ruth W.; Chen, Chang-Lee
(Institute of Electrical and Electronics Engineers, 2009-10)
In this work, we modified our wafer-scale 3D integration technique, originally developed for Si, to hybridize InP-based image sensor arrays with Si readout circuits. InGaAs image arrays based on the InGaAs layer grown on ...