Heat transfer via dropwise condensation on hydrophobic microstructured surfaces

Abstract

Dropwise condensation has the potential to greatly increase heat transfer rates. Heat transfer coefficients by dropwise condensation and film condensation on microstructured silicon chips were compared. Heat transfer coefficients are found to be seventy percent higher in the hydrophobic, dropwise condensation case relative to the hydrophilic, film condensation case. With this increased heat transfer coefficient, dropwise condensation using microstructures could improve many heat exchange applications, particularly electronics cooling.