Advanced Search

Microscale thermal engineering of electronic systems

Research and Teaching Output of the MIT Community

Show simple item record Goodson, K.E. 2004-10-28T19:45:39Z 2004-10-28T19:45:39Z 2003-05
dc.description.abstract The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing temperature rise in onchip interconnects. Millimeter-scale hotspots on microprocessors, resulting from varying rates of power consumption, are being addressed using two-phase microchannel heat sinks. Nanoscale thermal data storage technology has received much attention recently. This paper provides an overview of these topics with a focus on related research at Stanford University. en
dc.format.extent 1587318 bytes
dc.format.extent 323957 bytes
dc.format.mimetype application/pdf
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.title Microscale thermal engineering of electronic systems en
dc.type Presentation en
dc.type Technical Report en

Files in this item

Name Size Format Description
GOODSON.pdf 316.3Kb PDF Main article
GOODSONpres.pdf 1.513Mb PDF PPT presentation

This item appears in the following Collection(s)

Show simple item record