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Microscale thermal engineering of electronic systems

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dc.contributor.author Goodson, K.E.
dc.date.accessioned 2004-10-28T19:45:39Z
dc.date.available 2004-10-28T19:45:39Z
dc.date.issued 2003-05
dc.identifier.uri http://hdl.handle.net/1721.1/7305
dc.description.abstract The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing temperature rise in onchip interconnects. Millimeter-scale hotspots on microprocessors, resulting from varying rates of power consumption, are being addressed using two-phase microchannel heat sinks. Nanoscale thermal data storage technology has received much attention recently. This paper provides an overview of these topics with a focus on related research at Stanford University. en
dc.format.extent 1587318 bytes
dc.format.extent 323957 bytes
dc.format.mimetype application/pdf
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.title Microscale thermal engineering of electronic systems en
dc.type Presentation en
dc.type Technical Report en


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