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Warren M. Rohsenow Heat and Mass Transfer Laboratory >
Rohsenow Symposium on Future Trends in Heat Transfer >
Please use this identifier to cite or link to this item:
http://hdl.handle.net/1721.1/7313
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| Title: | Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers |
| Authors: | Chu, R.C.
Bar-Cohen, Avi
Edwards, David
Herrlin, Magnus
Price, Donald
Schmidt, Roger
Joshi, Jogenda
Chryser, George M.
Garimella, Suresh
Mok, Larry
Sammakia, Bahgat
Yeh, Lian-Tuu |
| Issue Date: | May-2003 |
| URI: | http://hdl.handle.net/1721.1/7313 |
| Appears in Collections: | Rohsenow Symposium on Future Trends in Heat Transfer
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Files in This Item:
| File |
Description |
Size | Format |
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| CHU_final.pdf | | 2327Kb | Adobe PDF | View/Open |
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