|
DSpace at MIT >
Warren M. Rohsenow Heat and Mass Transfer Laboratory >
Rohsenow Symposium on Future Trends in Heat Transfer >
Please use this identifier to cite or link to this item:
http://hdl.handle.net/1721.1/7313
|
| Title: | Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers |
| Authors: | Chu, R.C. Bar-Cohen, Avi Edwards, David Herrlin, Magnus Price, Donald Schmidt, Roger Joshi, Jogenda Chryser, George M. Garimella, Suresh Mok, Larry Sammakia, Bahgat Yeh, Lian-Tuu |
| Issue Date: | May-2003 |
| URI: | http://hdl.handle.net/1721.1/7313 |
| Appears in Collections: | Rohsenow Symposium on Future Trends in Heat Transfer
|
Files in This Item:
| File |
Description |
Size | Format |
| CHU_final.pdf | | 2327Kb | Adobe PDF | View/Open |
|
This item is protected by original copyright
|
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
|