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Thermal control of electronics: Perspectives and prospects

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dc.contributor.author Hannemann, R.J.
dc.date.accessioned 2004-10-29T19:42:10Z
dc.date.available 2004-10-29T19:42:10Z
dc.date.issued 2003-05
dc.identifier.uri http://hdl.handle.net/1721.1/7315
dc.description.abstract One of the most prominent industrial applications of heat transfer science and engineering has been electronics thermal control. Driven by the relentless increase in spatial density of microelectronic devices, integrated circuit chip powers have risen by a factor of 100 over the past twenty years, with a somewhat smaller increase in heat flux. The traditional approaches using natural convection and forced-air cooling are becoming less viable as power levels increase. This paper provides a high-level overview of the thermal management problem from the perspective of a practitioner, as well as speculation on the prospects for electronics thermal engineering in years to come. en
dc.format.extent 408117 bytes
dc.format.extent 214428 bytes
dc.format.mimetype application/pdf
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.title Thermal control of electronics: Perspectives and prospects en
dc.type Presentation en
dc.type Technical Report en


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