| dc.contributor.author |
Hannemann, R.J. |
|
| dc.date.accessioned |
2004-10-29T19:42:10Z |
|
| dc.date.available |
2004-10-29T19:42:10Z |
|
| dc.date.issued |
2003-05 |
|
| dc.identifier.uri |
http://hdl.handle.net/1721.1/7315 |
|
| dc.description.abstract |
One of the most prominent industrial applications of heat
transfer science and engineering has been electronics thermal
control. Driven by the relentless increase in spatial density of
microelectronic devices, integrated circuit chip powers have
risen by a factor of 100 over the past twenty years, with a
somewhat smaller increase in heat flux. The traditional
approaches using natural convection and forced-air cooling are
becoming less viable as power levels increase. This paper
provides a high-level overview of the thermal management
problem from the perspective of a practitioner, as well as
speculation on the prospects for electronics thermal engineering
in years to come. |
en |
| dc.description.provenance |
Submitted by Suzanne Williamson (smwillia@mit.edu) on 2004-10-29T16:07:55Z
No. of bitstreams: 2
HANNEMANNpres.pdf: 408117 bytes, checksum: 7e9bd882f2acfaf4acf72e19bc22ff0b (MD5)
HANNEMANN.pdf: 214428 bytes, checksum: b3a50bc17b45117fd203d186a30d2a9a (MD5) |
en |
| dc.description.provenance |
Approved for entry into archive by John Lienhard(lienhard@mit.edu) on 2004-10-29T19:42:09Z (GMT) No. of bitstreams: 2
HANNEMANNpres.pdf: 408117 bytes, checksum: 7e9bd882f2acfaf4acf72e19bc22ff0b (MD5)
HANNEMANN.pdf: 214428 bytes, checksum: b3a50bc17b45117fd203d186a30d2a9a (MD5) |
en |
| dc.description.provenance |
Made available in DSpace on 2004-10-29T19:42:10Z (GMT). No. of bitstreams: 2
HANNEMANNpres.pdf: 408117 bytes, checksum: 7e9bd882f2acfaf4acf72e19bc22ff0b (MD5)
HANNEMANN.pdf: 214428 bytes, checksum: b3a50bc17b45117fd203d186a30d2a9a (MD5)
Previous issue date: 2003-05 |
en |
| dc.format.extent |
408117 bytes |
|
| dc.format.extent |
214428 bytes |
|
| dc.format.mimetype |
application/pdf |
|
| dc.format.mimetype |
application/pdf |
|
| dc.language.iso |
en_US |
|
| dc.title |
Thermal control of electronics: Perspectives and prospects |
en |
| dc.type |
Presentation |
en |
| dc.type |
Technical Report |
en |
