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Plasma polymerization of C[subscript 4]F[subscript 8] thin film on high aspect ratio silicon molds

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dc.contributor.author Yeo, L. P.
dc.contributor.author Poh, S. L.
dc.contributor.author Lam, Yee Cheong
dc.contributor.author Chan-Park, Mary Bee-Eng
dc.date.accessioned 2004-12-14T20:48:37Z
dc.date.available 2004-12-14T20:48:37Z
dc.date.issued 2005-01
dc.identifier.uri http://hdl.handle.net/1721.1/7462
dc.description.abstract High aspect ratio polymeric micro-patterns are ubiquitous in many fields ranging from sensors, actuators, optics, fluidics and medical. Second generation PDMS molds are replicated against first generation silicon molds created by deep reactive ion etching. In order to ensure successful demolding, the silicon molds are coated with a thin layer of C[subscript 4]F[subscript 8] plasma polymer to reduce the adhesion force. Peel force and demolding status are used to determine if delamination is successful. Response surface method is employed to provide insights on how changes in coil power, passivating time and gas flow conditions affect plasma polymerization of C[subscript 4]F[subscript 8]. en
dc.description.sponsorship Singapore-MIT Alliance (SMA) en
dc.format.extent 679994 bytes
dc.format.mimetype application/pdf
dc.language.iso en
dc.relation.ispartofseries Innovation in Manufacturing Systems and Technology (IMST);
dc.subject C4F8 en
dc.subject plasma polymerization en
dc.subject peel force en
dc.subject demolding en
dc.title Plasma polymerization of C[subscript 4]F[subscript 8] thin film on high aspect ratio silicon molds en
dc.title.alternative Plasma polymerization of C4F8 thin film on high aspect ratio silicon molds en
dc.type Article en


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