Advanced Search
DSpace@MIT

Wafer bonding of processed Si CMOS VLSI and GaAs for mixed technology integration

Research and Teaching Output of the MIT Community

Files in this item

Name Size Format Description
50550216.pdf 8.231Mb PDF Preview, non-printable (open to all)
50550216-MIT.pdf 8.226Mb PDF Full printable version (MIT only)

This item appears in the following Collection(s)

MIT-Mirage