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dc.contributor.authorKim, Sanha
dc.contributor.authorSaka, Nannaji
dc.contributor.authorChun, Jung-Hoon
dc.date.accessioned2015-06-12T16:38:57Z
dc.date.available2015-06-12T16:38:57Z
dc.date.issued2014-06
dc.identifier.issn22128271
dc.identifier.urihttp://hdl.handle.net/1721.1/97402
dc.description.abstractIn chemical-mechanical polishing (CMP), surface asperities of the polishing pad play a key role, for they transmit normal force and impart tangential motion to the hard, nano-scale abrasive particles in the slurry. It has been shown recently, however, that the soft pad asperities themselves often generate micro-scale scratches on the surfaces being polished. To mitigate scratching by pad asperities, therefore, topography control by flattening pad asperities has been proposed and experimentally validated. In this study, the effects of asperity-flattening on pad topography and the material removal rate are investigated. It is found both theoretically and experimentally that even at a relatively high pressures only the tallest of the asperities are flattened and the ratio of asperity radius-to-standard deviation of heights is increased, but the average roughness itself is little affected. Specifically, surface profiles of new and asperity-flattened pads indeed show that the average roughness of about 5 μm is changed less than ten percent. Concurrently, the material removal rate is increased by about 30 percent due in part to the increased real area of contact––the result of increased asperity radius of curvature and decreased standard deviation of asperity heights.en_US
dc.description.sponsorshipSamsung (Firm)en_US
dc.language.isoen_US
dc.publisherElsevieren_US
dc.relation.isversionofhttp://dx.doi.org/10.1016/j.procir.2014.03.014en_US
dc.rightsCreative Commons Attribution-NonCommercial-No Derivative Works 3.0 Unporteden_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/3.0/en_US
dc.sourceProcedia CIRPen_US
dc.titleThe Effect of Pad-asperity Curvature on Material Removal Rate in Chemical-mechanical Polishingen_US
dc.typeArticleen_US
dc.identifier.citationKim, Sanha, Nannaji Saka, and Jung-Hoon Chun. “The Effect of Pad-Asperity Curvature on Material Removal Rate in Chemical-Mechanical Polishing.” Procedia CIRP 14 (2014): 42–47.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.departmentMassachusetts Institute of Technology. Laboratory for Manufacturing and Productivityen_US
dc.contributor.mitauthorKim, Sanhaen_US
dc.contributor.mitauthorSaka, Nannajien_US
dc.contributor.mitauthorChun, Jung-Hoonen_US
dc.relation.journalProcedia CIRPen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dspace.orderedauthorsKim, Sanha; Saka, Nannaji; Chun, Jung-Hoonen_US
dc.identifier.orcidhttps://orcid.org/0000-0002-8480-5572
dc.identifier.orcidhttps://orcid.org/0000-0002-3548-6173
dc.identifier.orcidhttps://orcid.org/0000-0003-1607-3581
mit.licensePUBLISHER_CCen_US
mit.metadata.statusComplete


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