This is an archived course. A more recent version may be available at ocw.mit.edu.

Lecture 17: Modules, Systems, and Reliability

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Description: Module manufacturing: encapsulation materials, availability, trends. Systems: Grid-tied and stand-alone, tracking and non-tracking. System components, including balance of systems components. Design criteria, tradeoffs, costs. Building integration, BIPV. Scaling, and power grid integration. Appropriate technology selection. Life cycle analysis. Failure: failure modes in stationary and tracking systems, accelerated testing, field testing, service and warranty contracts. Fire safety.

Instructor: Prof. Tonio Buonassisi

Modules, Systems, and Reliability (PDF - 3.2MB)

Supporting Materials

Articles referenced in this lecture: