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    • Effect of Wafer Bow and Etch Patterns in Direct Wafer Bonding 

      Spearing, S. Mark; Turner, K.T. (2003-01)
      Direct wafer bonding has been identified as an en-abling technology for microelectromechanical systems (MEMS). As the complexity of devices increase and the bonding of multiple patterned wafers is required, there is a need ...