Photonic integration in a commercial scaled bulk-CMOS process
Name
Orcutt-2009-Photonic integration in a commercial scaled bulk-CMOS process.pdf
Size
189.83 KB
Format
Adobe PDF
Checksum (MD5)
0540cf5fe74fffcd41161dded98b2bd9
Author(s)
Kaertner, Franz X.
Orcutt, Jason Scott
Khilo, Anatol M.
Popovic, M. A.
Holzwarth, Charles W.
Li, Hanqing
Sun, J.
Moss, Benjamin Roy
Dahlem, Marcus Vinicius Sobral
Ippen, Erich P.
Date Issued
November 2009
Journal
International Conference on Photonics in Switching, 2009. PS '09
Publisher
Institute of Electrical and Electronics Engineers
Citation
Orcutt, J.S. et al. “Photonic integration in a commercial scaled bulk-CMOS process.” Photonics in Switching, 2009. PS '09. International Conference on. 2009. 1-2. © 2009 IEEE.
Version
Final published version
Abstract
We demonstrate the first photonic chip designed for a commercial bulk CMOS process (65 nm-node) using standard process layers combined with post-processing, enabling dense photonic integration with high-performance microprocessor electronics.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Research Laboratory of Electronics
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1109/PS.2009.5307769
