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Competitive pricing and learning in CPU sockets

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Author(s)
Rahman, Mehrafshan Tabassum
Advisor(s)
Duane Boning and Donald Rosenfield.
Alternative Title
Competitive pricing and learning in central processing unit sockets
Date Issued
2011
Publisher
Massachusetts Institute of Technology
Abstract
An Intel processor can be electrically attached to a PC motherboard permanently or via a component called a socket. Intel defines the critical interfaces between the socket and the processor. Independent suppliers then manufacture the sockets and Intel validates the design of the sockets before they are sold to the original equipment manufacturers (OEMs). Sockets are the preferred mode of processor attachment for OEMs; however, the increase in price when a new socket is introduced has been a source of complaint by OEMs. This project seeks to better understand what factors contribute to socket costs and what can be done to better understand the increase in price when a new socket is released. This thesis provides a complete analysis on socket supplier development costs and determines that there is an optimal market situation that will minimize the socket cost for OEMs. After investigating different factors it is determined that the number of suppliers and level of competition are most strongly correlated with socket price. Furthermore, research shows that experience curves using competition as a factor are the most useful way of understanding socket price. Recommendations on ideal market share by supplier are provided as part of the results.
Description
Thesis (S.M.)--Massachusetts Institute of Technology, Engineering Systems Division; and, (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; in conjunction with the Leaders for Global Operations Program at MIT, 2011.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 64-66).
Subjects
Engineering Systems Division.
Sloan School of Management.
Leaders for Global Operations Program.
MIT Department
Leaders for Global Operations Program at MIT
Massachusetts Institute of Technology. Engineering Systems Division
Sloan School of Management
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http://dspace.mit.edu/handle/1721.1/7582
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http://hdl.handle.net/1721.1/67760
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