Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions
Name
Hsiao-2009-Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions.pdf
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217.09 KB
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Adobe PDF
Checksum (MD5)
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Author(s)
Daniel, Luca
Hsiao, Yu-Chung
El-Moselhy, Tarek Ali
Date Issued
November 2009
Journal
IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09
Publisher
Institute of Electrical and Electronics Engineers
Citation
Yu-Chung Hsiao, T. El-Moselhy, and L. Daniel. “Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions.” Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on. 2009. 179-182. ©2009 Institute of Electrical and Electronics Engineers.
Version
Final published version
Abstract
In this paper we show how the highly restrictive design rules of the recent sub-micro to nano-scale integrated circuit technologies allow to use a limited number of pre-computed surface charge distributions as a set of fundamental template basis functions in an efficient integral equation based 3D capacitance solver. Several examples verify that our solver can achieve final accuracies of less than 2% using 5times to 30times fewer unknowns than standard piecewise constant basis functions for the same accuracy, resulting in up to 25times speedups.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1109/EPEPS.2009.5338449
