Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability
Name
40606893-MIT.pdf
Description
Full printable version
Size
7.57 MB
Format
Adobe PDF
Checksum (MD5)
a06aaaf72d2a1c58e6fa83d70e9b4763
Author(s)
Clough, Sherry L. (Sherry Lynn), 1969-
Advisor(s)
Roy Welsch and Frederic McGarry.
Date Issued
1998
Publisher
Massachusetts Institute of Technology
Description
Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management; and, Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.
Includes bibliographical references (p. 109-110).
Subjects
Sloan School of Management
Materials Science and Engineering
MIT Department
Sloan School of Management
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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