Component-derived manufacturing yield prediction in circuit card design and assembly
Name
871336431-MIT.pdf
Description
Full printable version
Size
5.21 MB
Format
Adobe PDF
Checksum (MD5)
376c436818cbe16ed907a678ea3b9c3b
Author(s)
Trinh, Stephen
Advisor(s)
Martin Culpepper and Roy Welsch.
Date Issued
2013
Publisher
Massachusetts Institute of Technology
Abstract
Circuit card manufacturing can be a highly risky and volatile proposition due to the placement of hundreds of small, high value components. Operator mistakes, design errors, and defective parts lead to thousands of dollars in troubleshooting and rework costs per product. Raytheon Integrated Defense Systems (IDS) Circuit Card Assembly (CCA) manufactures highly complex circuit cards at a high mix / low volume scale for various purposes. Due to the high input variability and small production lot sizes of this level of circuit card manufacturing, historical trending and defect mitigation is difficult, causing a significant portion of CCA's manufacturing costs to be attributed to troubleshooting defects and rework. To mitigate these costs, yield prediction analysis software is utilized to predict potential manufacturing defect rates and first pass yields of new designs. This thesis describes the creation and testing of a new data analysis model for yield prediction. By gathering and processing data at an individual component level, the model can predict defect rates of designs at an assembly level. Collecting data at the individual component level drives more comprehensive component-based calculations, greatly improving yield prediction accuracy and thereby allowing cost effective circuit card designs to be created. The increase in prediction accuracy translates to a potential $250,000 saved annually for Raytheon CCA from early defect identification and removal. Updated data retrieval and calculation methods also allow for much easier model maintenance, thereby increasing the relevance of yield prediction. This model can be easily incorporated into other design software as a next step in creating comprehensive concurrent engineering tools.
Description
Thesis: M.B.A., Massachusetts Institute of Technology, Sloan School of Management, 2013. In conjunction with the Leaders for Global Operations Program at MIT.
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2013. In conjunction with the Leaders for Global Operations Program at MIT.
Cataloged from PDF version of thesis.
Includes bibliographical references (page 51).
Subjects
Mechanical Engineering.
Sloan School of Management.
Leaders for Global Operations Program.
MIT Department
Leaders for Global Operations Program at MIT
Massachusetts Institute of Technology. Department of Mechanical Engineering
Sloan School of Management
Terms of Use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Persistent DSpace Link
