Advanced electrochemical characterization of copper deposition
Name
994207164-MIT.pdf
Description
Full printable version
Size
10.71 MB
Format
Adobe PDF
Checksum (MD5)
3ab654798eb18974749d20d0b0ade831
Author(s)
Wagner, Mary Elizabeth, S.B. Massachusetts Institute of Technology
Advisor(s)
Antoine Allanore.
Date Issued
2016
Publisher
Massachusetts Institute of Technology
Abstract
The electrodeposition of copper metal in a concentrated sulfuric acid solution is reported to occur through a four-step mechanism: (I) the dehydration of Cu2+ (H2O)6, (II) the reduction of Cu2+ to cu+, (III) the dehydration cu+ (H2O)6-x, (IV) the reduction of Cu+ to copper metal. The dehydration steps have been found to be responsible for the pH-dependence of the electrodeposition reaction. It is also reported, although not well understood, that the presence of Fe2+ ions affects the reaction kinetics. In this work, the kinetics of copper electrodeposition were studied using alternating current cyclic voltammetry. The reaction was studied at a copper rotating disk electrode with varying concentrations of Cu2+ and Fe2+ . At sufficiently low pH, and a sufficiently high concentration of Fe2+ , the deposition kinetics may be slowed enough to separately observe the two electron transfer steps involved in copper reduction. It was found that Fe2+ ions affect the electrodeposition kinetic by slowing down reaction kinetics, particularly the second electron transfer reaction.
Description
Thesis: S.B., Massachusetts Institute of Technology, Department of Materials Science and Engineering, February 2016.
This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Cataloged from student-submitted PDF version of thesis.
Includes bibliographical references (pages 51-52).
Subjects
Materials Science and Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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