Measurement and Process Control in Precision Hot Embossing
Name
Hardt_Measurement and process.pdf
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846.61 KB
Format
Adobe PDF
Checksum (MD5)
029e713c6bef97fd027ae166bb371b87
Author(s)
Hardt, David E.
Bageant, Maia R
Date Issued
November 2015
Journal
Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition IMECE2013
Publisher
American Society of Mechanical Engineers (ASME)
Citation
Bageant, Maia R., and David E. Hardt. “Measurement and Process Control in Precision Hot Embossing.” ASME 2013 International Mechanical Engineering Congress and Exposition, 15-21 November, 2013, San Diego, California, USA, ASME, 2013. © 2013 by ASME
Version
Final published version
Abstract
Microfluidic technologies hold a great deal of promise in advancing the medical field, but transitioning them from research to commercial production has proven problematic. We propose precision hot embossing as a process to produce high volumes of devices with low capital cost and a high degree of flexibility. Hot embossing has not been widely applied to precision forming of hard polymers at viable production rates. To this end we have developed experimental equipment capable of maintaining the necessary precision in forming parameters while minimizing cycle time. In addition, since equipment precision alone does not guarantee consistent product quality, our work also focuses on real-time sensing and diagnosis of the process.
This paper covers both the basic details for a novel embossing machine, and the utilization of the force and displacement data acquired during the embossing cycle to diagnose the state of the material and process. The precision necessary in both the forming machine and the instrumentation will be covered in detail. It will be shown that variation in the material properties (e.g. thickness, glass transition temperature) as well as the degree of bulk deformation of the substrate can be detected from these measurements. If these data are correlated with subsequent downstream functional tests, a total measure of quality may be determined and used to apply closed-loop cycle-to-cycle control to the entire process. By incorporating automation and specialized precision equipment into a tabletop “microfactory” setting, we aim to demonstrate a high degree of process control and disturbance rejection for the process of hot embossing as applied at the micron scale.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Massachusetts Institute of Technology. Laboratory for Manufacturing and Productivity
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1115/IMECE2013-65788
