Repository logo
Log in(current)
Repository logoMIT Open ScholarshipDSpace@MIT
  1. Home
  2. MIT Open Access Articles
  3. MIT Open Access Articles
  4. Non-random walk diffusion enhances the sink strength of semicoherent interfaces

Non-random walk diffusion enhances the sink strength of semicoherent interfaces

Thumbnail Image
Download
Name

Vattre-2016-Non-random Walk.pdf

Size

1.88 MB

Format

Adobe PDF

Checksum (MD5)

303a7de0fcb3a37eaac155acde20a1eb

Author(s)
Jourdan, T.
•
Marinica, M.-C.
•
Vattre, A.
•
Ding, Hepeng
•
Demkowicz, Michael J.
Date Issued
January 2016
Journal
Nature Communications
Publisher
Nature Publishing Group
Citation
Vattré, A., T. Jourdan, H. Ding, M.-C. Marinica, and M. J. Demkowicz. “Non-Random Walk Diffusion Enhances the Sink Strength of Semicoherent Interfaces.” Nat Comms 7 (January 29, 2016): 10424.
Version
Final published version
Abstract
Clean, safe and economical nuclear energy requires new materials capable of withstanding severe radiation damage. One strategy of imparting radiation resistance to solids is to incorporate into them a high density of solid-phase interfaces capable of absorbing and annihilating radiation-induced defects. Here we show that elastic interactions between point defects and semicoherent interfaces lead to a marked enhancement in interface sink strength. Our conclusions stem from simulations that integrate first principles, object kinetic Monte Carlo and anisotropic elasticity calculations. Surprisingly, the enhancement in sink strength is not due primarily to increased thermodynamic driving forces, but rather to reduced defect migration barriers, which induce a preferential drift of defects towards interfaces. The sink strength enhancement is highly sensitive to the detailed character of interfacial stresses, suggesting that ‘super-sink’ interfaces may be designed by optimizing interface stress fields. Such interfaces may be used to create materials with unprecedented resistance to radiation-induced damage.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
Creative Commons Attribution
http://creativecommons.org/licenses/by/4.0/
Persistent DSpace Link
http://hdl.handle.net/1721.1/101868
DOI of Published Version
https://doi.org/10.1038/ncomms10424
Repository logo
PrivacyPermissionsAccessibilityContact us
Repository logo
Notify us about copyright concerns.