Discrete Integrated Circuit Electronics (DICE)
Name
20.09.DICE.pdf
Description
Accepted version
Size
6.09 MB
Format
Adobe PDF
Checksum (MD5)
ade7de3f577eaff965c614a02e32342f
Author(s)
Fredin, Z
Zemanek, J
Blackburn, C
Strand, E
Abdel-Rahman, A
Rowles, P
Gershenfeld, N
Date Issued
2020
Journal
2020 IEEE High Performance Extreme Computing Conference, HPEC 2020
Publisher
IEEE
Citation
Fredin, Z, Zemanek, J, Blackburn, C, Strand, E, Abdel-Rahman, A et al. 2020. "Discrete Integrated Circuit Electronics (DICE)." 2020 IEEE High Performance Extreme Computing Conference, HPEC 2020.
Version
Author's final manuscript
Abstract
© 2020 IEEE. We introduce DICE (Discrete Integrated Circuit Electronics). Rather than separately develop chips, packages, boards, blades, and systems, DICE spans these scales in a direct-write process with the three-dimensional assembly of computational building blocks. We present DICE parts, discuss their assembly, programming, and design workflow, illustrate applications in machine learning and high performance computing, and project performance.
MIT Department
Center for Brains, Minds, and Machines
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1109/HPEC43674.2020.9286236
