Continuation-Based Pull-In and Lift-Off Simulation Algorithms for Microelectromechanical Devices
Name
4. mems pull-in.pdf
Size
467.87 KB
Format
Adobe PDF
Checksum (MD5)
6cad419cc45b955188e4b0c6d4ed98cf
Author(s) • •
Zhang, Zheng
Kamon, Mattan
Daniel, Luca
Date Issued
October 2014
Journal
Journal of Microelectromechanical Systems
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Zhang, Zheng, Mattan Kamon, and Luca Daniel. “Continuation-Based Pull-In and Lift-Off Simulation Algorithms for Microelectromechanical Devices.” J. Microelectromech. Syst. 23, no. 5 (October 2014): 1084–1093. © 2014
Version
Author's final manuscript
Abstract
The voltages at which microelectromechanical actuators and sensors become unstable, known as pull-in and lift-off voltages, are critical parameters in microelectromechanical systems (MEMS) design. The state-of-the-art MEMS simulators
compute these parameters by simply sweeping the voltage, leading to either excessively large computational cost or to convergence failure near the pull-in or lift-off points. This paper proposes to simulate the behavior at pull-in and lift-off employing
two continuation-based algorithms. The first algorithm appropriately adapts standard continuation methods, providing a complete set of static solutions. The second algorithm uses continuation to trace two kinds of curves and generates the sweep-up or sweep-down curves, which can provide more intuition for MEMS designers. The algorithms presented in this paper are robust and suitable for general-purpose industrial MEMS designs. Our algorithms have been implemented in a commercial MEMS/integrated circuits codesign tool, and their effectiveness is validated by comparisons against measurement data and the commercial finite-element/boundary-element (FEM/BEM) solver CoventorWare.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Computation for Design and Optimization Program
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
Persistent DSpace Link
DOI of Published Version
http://creativecommons.org/licenses/by-nc-sa/4.0/