Adhesion of voids to bimetal interfaces with non-uniform energies
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Zheng_Adhesion of voids.pdf
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Author(s) • • • • • •
Zheng, Shijian
Shao, Shuai
Zhang, Jian
Wang, Yongqiang
Demkowicz, Michael J.
Beyerlein, Irene J.
Mara, Nathan A.
Date Issued
October 2015
Journal
Scientific Reports
Publisher
Nature Publishing Group
Citation
Zheng, Shijian, Shuai Shao, Jian Zhang, Yongqiang Wang, Michael J. Demkowicz, Irene J. Beyerlein, and Nathan A. Mara. “Adhesion of Voids to Bimetal Interfaces with Non-Uniform Energies.” Scientific Reports 5 (October 21, 2015): 15428.
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Final published version
Abstract
Interface engineering has become an important strategy for designing radiation-resistant materials. Critical to its success is fundamental understanding of the interactions between interfaces and radiation-induced defects, such as voids. Using transmission electron microscopy, here we report an interesting phenomenon in their interaction, wherein voids adhere to only one side of the bimetal interfaces rather than overlapping them. We show that this asymmetrical void-interface interaction is a consequence of differing surface energies of the two metals and non-uniformity in their interface formation energy. Specifically, voids grow within the phase of lower surface energy and wet only the high-interface energy regions. Furthermore, because this outcome cannot be accounted for by wetting of interfaces with uniform internal energy, our report provides experimental evidence that bimetal interfaces contain non-uniform internal energy distributions. This work also indicates that to design irradiation-resistant materials, we can avoid void-interface overlap via tuning the configurations of interfaces.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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DOI of Published Version
https://doi.org/10.1038/srep15428