Jumping-Droplet-Enhanced Condensation on Scalable Superhydrophobic Nanostructured Surfaces
Name
Jumping-Droplet-Enhanced Condensation on Scalable Superhydrophobic Nanostructured Surfaces.pdf
Description
Main article, figures, and supplementary information
Size
2.08 MB
Format
Adobe PDF
Checksum (MD5)
61e6a34557d641e23982780d4059a0d9
Author(s)
Miljkovic, Nenad
Enright, Ryan
Nam, Youngsuk
Lopez, Ken
Dou, Nicholas G.
Sack, Jean H.
Wang, Evelyn N.
Date Issued
November 2012
Journal
Nano Letters
Publisher
American Chemical Society
Citation
Miljkovic, Nenad, Ryan Enright, Youngsuk Nam, Ken Lopez, Nicholas Dou, Jean Sack, and Evelyn N. Wang. "Jumping-Droplet-Enhanced Condensation on Scalable Superhydrophobic Nanostructured Surfaces." Nano Letters 2013 13 (1), 179-187.
Version
Author's final manuscript
Abstract
When droplets coalesce on a superhydrophobic nanostructured surface, the resulting droplet can jump from the surface due to the release of excess surface energy. If designed properly, these superhydrophobic nanostructured surfaces can not only allow for easy droplet removal at micrometric length scales during condensation but also promise to enhance heat transfer performance. However, the rationale for the design of an ideal nanostructured surface as well as heat transfer experiments demonstrating the advantage of this jumping behavior are lacking. Here, we show that silanized copper oxide surfaces created via a simple fabrication method can achieve highly efficient jumping-droplet condensation heat transfer. We experimentally demonstrated a 25% higher overall heat flux and 30% higher condensation heat transfer coefficient compared to state-of-the-art hydrophobic condensing surfaces at low supersaturations (<1.12). This work not only shows significant condensation heat transfer enhancement but also promises a low cost and scalable approach to increase efficiency for applications such as atmospheric water harvesting and dehumidification. Furthermore, the results offer insights and an avenue to achieve high flux superhydrophobic condensation.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1021/nl303835d
