Long-term reliable physical health monitoring by sweat pore–inspired perforated electronic skins
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sciadv.abg8459.pdf
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Published version
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5.49 MB
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Author(s) • • • • • • • • •
Yeon, Hanwool
Lee, Haneol
Kim, Yeongin
Lee, Doyoon
Lee, Youngjoo
Lee, Jong-Sung
Shin, Jiho
Choi, Chanyeol
Kang, Ji-Hoon
Suh, Jun Min
Date Issued
2021
Journal
Science Advances
Publisher
American Association for the Advancement of Science (AAAS)
Citation
Yeon, Hanwool, Lee, Haneol, Kim, Yeongin, Lee, Doyoon, Lee, Youngjoo et al. 2021. "Long-term reliable physical health monitoring by sweat pore–inspired perforated electronic skins." Science Advances, 7 (27).
Version
Final published version
Abstract
Electronic skins (e-skins)-electronic sensors mechanically compliant to human skin-have long been developed as an ideal electronic platform for noninvasive human health monitoring. For reliable physical health monitoring, the interface between the e-skin and human skin must be conformal and intact consistently. However, conventional e-skins cannot perfectly permeate sweat in normal day-to-day activities, resulting in degradation of the intimate interface over time and impeding stable physical sensing. Here, we present a sweat pore-inspired perforated e-skin that can effectively suppress sweat accumulation and allow inorganic sensors to obtain physical health information without malfunctioning. The auxetic dumbbell through-hole patterns in perforated e-skins lead to synergistic effects on physical properties including mechanical reliability, conformability, areal mass density, and adhesion to the skin. The perforated e-skin allows one to laminate onto the skin with consistent homeostasis, enabling multiple inorganic sensors on the skin to reliably monitor the wearer's health over a period of weeks.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Massachusetts Institute of Technology. Research Laboratory of Electronics
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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Creative Commons Attribution NonCommercial License 4.0
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DOI of Published Version
https://doi.org/10.1126/SCIADV.ABG8459