Solid-State Qubits: 3D Integration and Packaging
Name
1906.11146.pdf
Description
Submitted version
Size
1.35 MB
Format
Adobe PDF
Checksum (MD5)
d51a714e527e99f5be7ebbb800318e09
Author(s)
Rosenberg, D
Weber, SJ
Conway, D
Yost, DRW
Mallek, J
Calusine, G
Das, R
Kim, D
Schwartz, ME
Woods, W
Alternative Title
Solid-State Qubits: 3D Integration and Packaging
Date Issued
August 1, 2020
Journal
IEEE Microwave Magazine
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Version
Original manuscript
Abstract
© 2000-2012 IEEE. Quantum processing has the potential to transform the computing landscape by enabling efficient solutions to problems that are intractable using classical processors. The field was sparked by a suggestion from physicist Richard Feynman in 1981 that a controllable quantum system can be used to simulate other quantum systems, such as the energy band structure of complex materials or the chemical reaction rates of intricate molecules. In the 1990s, interest in quantum computing grew rapidly with the introduction of the first quantum "killer app"-the potential of a large-scale quantum processor to break certain types of public encryption schemes [1]. Recently, there has been growing consensus that myriad other fields besides data security could be impacted by the development of a quantum processor, including machine learning [2], many optimization problems [3], and Feynman's original idea of the simulation of materials properties [4]. In recent years, the field has progressed rapidly, but many technical challenges must be overcome before a large-scale quantum processor can be built. This article focuses on the development of packaging for solid-state qubits and the use of 3D integration to address this challenge.
MIT Department
Lincoln Laboratory
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1109/MMM.2020.2993478
