Finite Element Simulation of Hot Nanoindentation in Vacuum
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11340_2012_9700_ReferencePDF.pdf
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649.96 KB
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63a30b03446ff5c7e5f29c45dc8cd191
Author(s)
Lee, Hunken
Chen, Ying
Claisse, Antoine
Schuh, Christopher A.
Date Issued
February 2013
Journal
Experimental Mechanics
Publisher
Springer US
Citation
Lee, H., Y. Chen, A. Claisse, and C.A. Schuh. “Finite Element Simulation of Hot Nanoindentation in Vacuum.” Experimental Mechanics 53, no. 7 (February 5, 2013): 1201–1211.
Version
Author's final manuscript
Abstract
A finite element model is developed to investigate technical issues associated with hot nanoindentation measurements in vacuum, e.g. thermal expansion-induced drift and temperature variations at the contact region between the cold indenter tip and hot specimen. With heat conduction properly accounted for, the model is able to reasonably reproduce experimental indentation measurements on fused silica and copper—two materials with significantly different thermal and mechanical properties—at several temperatures. Temperature and loading rate effects on thermal drift are established using this model and an analytical expression for predicting thermal drift is numerically calibrated. The model also captures details of the indentation process that are not directly accessible experimentally, and reaffirms the need for operational refinements in order to acquire high temperature indentation data of high quality, especially in a vacuum environment. Such information can guide experiments aimed at understanding thermally-activated phenomena in materials.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
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DOI of Published Version
https://doi.org/10.1007/s11340-012-9700-7
