A high-throughput technique for determining grain boundary character non-destructively in microstructures with through-thickness grains
Name
A high-throughput.pdf
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1.66 MB
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Author(s)
Seita, Matteo
Volpi, Marco
Patala, Srikanth
McCue, Ian
Schuh, Christopher A
Diamanti, Maria Vittoria
Erlebacher, Jonah
Demkowicz, Michael J
Date Issued
June 2016
Journal
npj Computational Materials
Publisher
Springer Nature
Citation
Seita, Matteo, Marco Volpi, Srikanth Patala, Ian McCue, Christopher A Schuh, Maria Vittoria Diamanti, Jonah Erlebacher, and Michael J Demkowicz. “A High-Throughput Technique for Determining Grain Boundary Character Non-Destructively in Microstructures with through-Thickness Grains.” Npj Computational Materials 2 (June 24, 2016): 16016.
Version
Final published version
Abstract
Grain boundaries (GBs) govern many properties of polycrystalline materials. However, because of their structural variability, our knowledge of GB constitutive relations is still very limited. We present a novel method to characterise the complete crystallography of individual GBs non-destructively, with high-throughput, and using commercially available tools. This method combines electron diffraction, optical reflectance and numerical image analysis to determine all five crystallographic parameters of numerous GBs in samples with through-thickness grains. We demonstrate the technique by measuring the crystallographic character of about 1,000 individual GBs in aluminum in a single run. Our method enables cost- and time-effective assembly of crystallography–property databases for thousands of individual GBs. Such databases are essential for identifying GB constitutive relations and for predicting GB-related behaviours of polycrystalline solids.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Massachusetts Institute of Technology. Department of Mechanical Engineering
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Creative Commons Attribution 4.0 International License
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DOI of Published Version
https://doi.org/10.1038/npjcompumats.2016.16
